Ultron Systems' Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each program may have up to 99 different cleaning/rinsing/drying steps with a maximum of 999 seconds per step. The unit is capable of cleaning wafers up to 8-inches in diameter or up to 6-inches in diameter mounted on a film frame or grip ring. An optional liquid additive injection feature is available to facilitate the cleaning cycles. Both hot and cool dry modes are available for faster, more efficient drying.
| FEATURES: |
| - Semiautomatic operation, fully programmable |
| - Touchscreen LCD panel |
| - Microprocessor control, ensures precise, flexible, uniform, and repeatable cleaning |
| - Store 10 programs, each with up to 99 different clean/rinse/dry steps, with 999 seconds maximum per step |
| - Non-volatile memory for program storage |
| - Accommodates up to 8" diameter wafers; and up to 6" diameter wafers mounted on a film frame or grip ring |
| - Interchangeable chuck capability |
| - Both hot and cool dry modes available |
| - Standard wafer/wafer carrier chuck with vacuum hold (specify wafer/wafer carrier size) |
ULTRON SYSTEMS, INC.
