Ultron Systems, Inc. -- Wafer Backgrinding Protective-Film Remover

Model UH110 Series: (UH110, UH110-8)

Ultron Systems' Model UH110 and UH110-8 Semiautomatic Film Removers demount film from
3" to 8" wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields.
Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment. Throughput is as high as 200 wafers/hour. The standard Model UH110 can accommodate up to 6" wafers, while the Model UH110-8 handles 8" wafers and smaller. Adjustments from one size wafer to another can be made in seconds by simply changing the workstage. Push-button operation assures ease of use with all operator variables eliminated.

FEATURES:

- Short removal cycle for higher throughput

- Virtual 180° peeling angle for lower wafer stress and higher yields

- Heated wafer stage: ensures film removal with minimal stress to wafer

- Quick peeling-tape reloading

- Easy disposal of demounted protective film

- No special operator training required

- Compact, tabletop size

- Faster and lower cost than conventional chemical removal method

- Interchangeable wafer stage accommodates different size/type of wafers

- Removes film from wafers down to 8 mil thick wafer [UH110-8]

- [Model UH110]: Up to 6" wafer/film frame capability (Standard wafer stage included)

- [Model UH110-8]: Up to 8" wafer/film frame capability (Standard 8" stage included)

OPTIONS:

- Additional Standard Wafer Stage [up to 6" for UH110; up to 8" for UH110-8]

- Thin Wafer Stage [up to 6" for UH110; up to 8" for UH110-8]

- Static Eliminator with Power Safety Interlock Switch [UH110-8]

- 'CE' Mark

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