FEATURES: |
- Adjustable spring-loaded roller assembly ensures bubble-free lamination |
- Adjustable cutting angle, depth, and diameter to control the amount of film overhang |
- Adjustable roller pressure from topside to accommodate different film requirements and various wafer thicknesses |
- Cuts film to edge of wafer, including flats, within 0.005" |
- Vacuum-securing wafer stage |
- Wafer-centering mechanism |
- Retractable cutting knife blade for operator safety |
- Adjustable alignment pins accommodate any wafer size |
- Adjustable cutter assembly for either a "contact cut" (wafers with alignment flat(s)) OR a "non-contact cut" (wafers with an alignment notch) |
- Spring-loaded tensioner bar prevents wafer stress due to film stretch |
- Operates with backed or non-backed film. Optional Take-up Roller Assembly available for film with backed liner. |
OPTIONS: |
- Protective Film Take-up Roller Assembly: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films, which automatically winds the protective layer onto a plastic core for easy handling and disposal. |
- Static Eliminator (with or without Power Safety Interlock Switch): A static ionization bar prevents static build-up caused from either the film unwinding or from the separation of the film from the protective layer. |
- 'CE' Mark |
[Model UH108-8]: |
- 5" Wafer Capability |
- 6" Wafer Capability |
[Model UH108-12]: |
- 8" & 12" Wafer Capability |
*** REQUEST FURTHER DETAILED INFORMATION |