Mounter_UH114
DieMatrixExpander
Wafer_Cleaning_UH117
DieMatrixExpander
DieMatrixExpander
Model UH117
Cleaner_UH117
Ultron Systems' Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each program may have up to 99 different cleaning/rinsing/drying steps with a maximum of 999 seconds per step. The unit is capable of cleaning wafers up to 8-inches in diameter or up to 6-inches in diameter mounted on a film frame or grip ring. An optional liquid additive injection feature is available to facilitate the cleaning cycles. Both hot and cool dry modes are available for faster, more efficient drying.

FEATURES:
- Semiautomatic operation, fully programmable
- Touchscreen LCD panel
- Microprocessor control, ensures precise, flexible, uniform, and repeatable cleaning
- Store 10 programs, each with up to 99 different clean/rinse/dry steps, with 999 seconds maximum per step
- Non-volatile memory for program storage
- Accommodates up to 8" diameter wafers; and up to 6" diameter wafers mounted on a film frame or grip ring
- Interchangeable chuck capability
- Both hot and cool dry modes available
- Standard wafer/wafer carrier chuck with vacuum hold (specify wafer/wafer carrier size)

OPTION:
- Liquid Additive Injection Capability (under program control during wash cycle)
- Standard Brush or Soft Brush
*** REQUEST FURTHER DETAILED INFORMATION
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Cleaner_UH118
Cleaner_UH118_Open
The Model UH118 Wafer Cleaning System provides an optimal solution for cleaning wafers after dicing or scribing. Capable of cleaning either 12" or 8" (film frame mounted) wafers semiautomatically, the UH118 is fully programmable via a touchscreen LCD panel, eliminating operator variables.

The system is microprocessor-controlled to ensure precise, flexible, uniform, and repeatable cleaning. Ten programs with up to 99 different cleaning/rinsing/drying steps of up to 999 seconds maximum can be stored for different processes. Further, brush speed is programmable, and an the workstage height (with built-in safety interlock) is electronically adjustable by simply entering substrate thickness.

The Model UH118 provides dual-liquid additive capability through independent channels, in addition to the separate DI water channel. For more efficient drying, the unit is equipped with a dual heater system and a new 300 rpm air knife-assisted low-spin cycle. The Model UH118 takes wafer cleaning to the next level.

FEATURES:
- Large brush accommodates 12" (300mm) wafer or 8" (200mm) wafer with frame
- Microprocessor control, ensures precise, flexible, uniform, and repeatable cleaning
- Wafer cleaning with DI water and up to 2 different additives
- Dual heater, hot air over the wafer surface for faster drying
- Programmable stage/chuck height adjustment
- Interchangeable chuck capability
- Programmable brush rotation speed
- Programmable wash, rinse, and dry cycles
- Store 10 programs, each with up to 99 different clean/rinse/dry steps, with 999 seconds maximum per step
- Non-volatile memory for program storage
- Spin dry (at 300 rpm)
- Standard wafer/wafer carrier chuck with vacuum hold (specify wafer/wafer carrier size)

OPTION:
- Standard Brush or Soft Brush
*** REQUEST FURTHER DETAILED INFORMATION

 

 

 

 

 

 

 

 

 

 

 

Model UH118
PRODUCTS:
WAFER CLEANING SYSTEMS