Mounter_Process
Mounter_UH114
DieMatrixExpander
Wafer_Cleaning_UH117
DieMatrixExpander
DieMatrixExpander
Model UH114 Series: (UH114, UH114-8, UH114-12)
Mounter_UH114-8
UH114-8 with Adapter Ring option shown
Mounter_UH114-8_Chuck
Ultron Systems' Model UH114 & UH115 Series Mounters set the benchmark for both control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. Our mounters feature an easily adjustable spring-loaded roller assembly, along with film-tensioner bars along both the x- and y-axes to ensure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller ensures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses. Using our Mounters, operator variables are virtually eliminated.

Our mounters are available in 6", 8", and 12" wafer / film frame models and feature:

FEATURES:
- Easily adjustable spring-loaded roller assembly
- Uniform film tension: Film tensioner bars (along both x/y-axes and front/rear for UH114; in the front & rear for UH114-8, -12)
- Uniform adhesion provides bubble-free lamination
- Circular cutter (wheel-type) for cutting film on film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Digital temperature controlled platen
- Adjustable workstage height from top of unit
- Operates with non-backed or backed (optional) film
- Accommodates film/protective layer wound on the outside or inside
- Adjustable alignment pins and vacuum cups
- Accepts all film frames (specify type and size)
- End cutter for film separation
- Accommodates wafer up to 6" capability (UH114); wafer up to 8" capability (UH114-8); wafer up to 12" capability (UH114-12)

OPTIONS:
- Protective Film Take-up Roller Assembly for use with film with backing layer
- Static Eliminator (with or without) Power Safety Interlock Switch
- Magnetic Main Plate Assy
- 'CE' Mark
MODEL UH114:
- Vacuum-Securing Standard Wafer Stage: up to 6" wafer, or 3"-6" multi-chuck
- Thin Wafer Stage, up to 6" wafer
MODEL UH114-8:
- Vacuum-Securing Standard Wafer Stage, up to 8" wafer
- Thin Wafer Stage, up to 8" wafer
- Film Frame Adapter Ring: 8" <=> 6"
MODEL UH114-12:
- Vacuum-Securing Standard Wafer Stage for 12" (300mm) wafers
- Vacuum-Securing Standard Wafer Stage for 8" wafers (Adapter required, below)
- Adapter for 8" Wafer Film Frame
- Thin Wafer Stage, up to 12" wafer
- Film Frame Adapter Ring: 12" <=> 8"
*** REQUEST FURTHER DETAILED INFORMATION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mounter_UH115
SofTouch option shown
Mounter_UH115_Chuck
FEATURES:
- Automatic motor-driven, one-pass uniform film lamination
- Uniform adhesion provides bubble-free lamination
- "Crease lines" eliminated from lamination area
- Three modes of laminating roller operation: fast, slow, or momentary
- Digital temperature controlled platen
- Uniform film tension; Film tensioner bars in both front and rear
- Adjustable workstage height from top of unit
- Circular cutter (wheel-type) for cutting film on film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Operates with non-backed or backed (optional) film
- Accommodates film/protective layer wound on the outside or inside
- Adjustable motorized roller speed and pressure
- Easily adjustable spring-loaded roller assembly
- Adjustable alignment pins and vacuum cups
- Accepts all film frames (specify type, size)
- End cutter for film separation
- Accommodates wafer up to 6" capability (UH115); wafer up to 8" capability (UH115-8); wafer up to 12" capability (UH115-12)

OPTIONS:
- SofTouch (Edge-contact) Workstage
- Static Eliminator (with or without) Power Safety Interlock Switch
- Protective Film Take-up Roller Assembly
- Magnetic Main Plate Assy
- 'CE' Mark
MODEL UH115:
- Vacuum-Securing Standard Wafer Stage: up to 6" wafer, or 3"-6" multi-chuck
- Thin Wafer Stage, up to 6" wafer
- SofTouch Stage, 5" and 6" wafer sizes
MODEL UH115-8:
- Vacuum-Securing Standard Wafer Stage, up to 8" wafer
- Thin Wafer Stage, up to 8" wafer
- SofTouch Stage, up to 8" wafer
- Film Frame Adapter Ring: 8" <=> 6"
MODEL UH115-12:
- Vacuum-Securing Standard Wafer Stage for 12" (300mm) wafers
- Vacuum-Securing Standard Wafer Stage for 8" wafers (Adapter required, below)
- Adapter for 8" Wafer Film Frame
- Thin Wafer Stage, up to 12" wafer
- SofTouch Stage, up to 12" wafer
- Film Frame Adapter Ring: 12" <=> 8"
*** REQUEST FURTHER DETAILED INFORMATION
Based on the highly successful Model UH114 Series Wafer/Frame Film Applicators, the Model UH115 represents the next level of bubble-free film lamination to all sizes of wafers and types of film frames. The Model UH115 Series Mounters feature a semiautomatic one-pass lamination which provides an extra margin of safety when mounting particularly fragile wafers/substrates. Most manual mounters laminate the film in two passes, i.e., one pass as the film is laminated to the film frame and wafer/substrate, and a second relaminating pass as the roller returns to its home position. The Model UH115 Series, however, laminates on the first pass only; the second pass is contact-free. Additionally, the film unwinds along a new roller path so that "crease lines" -- which are common to most film mounters and occur at the point the unwound film meets the film roll -- are eliminated from the lamination area. Adjustable circle cutting pressure accommodates adhesive plastic film of various thicknesses.

 

 

 

 

 

 

 

 

 

 

 

Model UH115 Series: (UH115, UH115-8, UH115-12)
FEATURES UH114 SERIES UH115 SERIES
- Easily adjustable spring-loaded roller assembly
X
X
- Uniform film tension: Film tensioner bars
X
X
- Automatic motor-driven, one-pass uniform film lamination
X
- Three modes of laminating roller operation: fast, slow, or momentary
X
- Uniform adhesion provides bubble-free lamination
X
X
- Circular cutter (wheel-type) for cutting film on film frame
X
X
- Adjustable cutting pressure for different films (thickness/hardness)
X
X
- Adjustable motorized roller speed and pressure
X
- Digital temperature controlled platen
X
X
- Adjustable workstage height from top of unit
X
X
- Operates with non-backed or backed (optional) film
X
X
- Accommodates film/protective layer wound on the outside or inside
X
X
- Adjustable alignment pins and vacuum cups
X
X
- Accepts all film frames (specify type and size)
X
X
- End cutter for film separation
X
X
- Accommodates wafers up to 6" capability (UH114, UH115); wafers up to 8" capability (UH114-8, UH115-8); wafers up to 12" capability (UH114-12, UH115-12)
X
X
- SofTouch (Edge-contact) Workstage
OPTION
- Protective Film Take-up Roller Assembly for use with film with backing layer
OPTION
OPTION
- Static Eliminator (with or without) Power Safety Interlock Switch
OPTION
OPTION
- Film Frame Adapter Ring: 8"<=>6" (UH114-8, UH115-8), 12"<=>8" (UH114-12, UH115-12)
OPTION
OPTION
- Vacuum-Securing Standard Wafer Stage
OPTION
OPTION
- Magnetic Main Plate Assembly
OPTION
OPTION
- Thin Wafer Stage
OPTION
OPTION
- 'CE' Mark
OPTION
OPTION

 

 

PRODUCTS:
WAFER / FRAME FILM MOUNTERS